X00602MA 5AL2

X006 Datasheet 0.8 A 600 V logic level gate thyristor SCR in TO-92 package A Features • On-state RMS current, IT(RMS) 0.8 A K • • • Repetitive peak off-state voltage 600 V Triggering gate current 200 μA ECOPACK2 compliant G Applications K TO-92 (preform) G A TO-92 (straight) K G A • • • • • • Limited gate current topologies Ground fault circuit interrupters Overvoltage crowbar protection in power supplies Protection in electronic ballasts Capacitive discharge ignitions Ignitors (lighting, oven...) Product status link Description X006 Product summary IT(RMS) 0.8 A VDRM/VRRM 600 V IGT 200 µA Tjmax. 125 °C Available in through hole package, the X006 SCR can be used as on/off function in applications where topology does not offer high current for gate triggering. This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. Thanks to its highly sensitive triggering current the X006 is suitable for the applications such as breaker, ground fault interrupter, overvoltage crowbar protection of power supplies or capacitive ignition circuits. DS1704 - Rev 6 - January 2022 For further information contact your local STMicroelectronics sales office. www.st.com X006 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values, Tj = 25 °C unless otherwise specified) Symbol IT(RMS) IT(AV) ITSM I2t dl/dt IGM PG(AV) Tstg Tj Parameters Value Unit On-state RMS current (180° conduction angle) TO-92 TL = 83 °C 0.8 A Average on-state current (180° conduction angle) TO-92 TL = 83 °C 0.5 A Non repetitive surge peak on-state current, tp = 8.3 ms Tj initial = 25 °C tp = 10 ms I2t value for fusing tp = 10 ms Tj = 25 °C 0.4 A2s F = 60 Hz Tj = 125 °C 50 A/µs tp = 20 µs Tj = 125 °C 1 A Tj = 125 °C 0.1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation 10 Tj = 25 °C A 9 Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT Parameters Value VD = 12 V, RL = 140 Ω VGT Unit Min. 15 Max. 200 Max. 0.8 V V µA VGD VD = VDRM, RL = 3.3 kΩ, RGK = 1 kΩ, Tj = 125 °C Min. 0.2 VRG IRG = 10 µA Min. 5 IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA IL IG = 1 mA, RGK = 1 kΩ Max. 6 mA VD = 67 % VDRM, RGK = 1 kΩ, Tj = 125 °C Min. 25 V/µs Value Unit dV/dt Table 3. Static electrical characteristics Symbol Test conditions VTM ITM = 1 A, tp = 380 µs 25 °C Max. 1.35 V VTO Threshold on-state voltage 125 °C Max. 0.85 V Rd Dynamic resistance 125 °C Max. 245 mΩ IDRM VDRM = VRRM, RGK = 1 kΩ 25 °C IRRM VDRM = VRRM, RGK = 1 kΩ 125 °C Max. 1 100 µA Table 4. Thermal resistance Symbol DS1704 - Rev 6 Max. value Parameters Rth(j-l) Junction to leads (DC) TO-92 70 Rth(j-a) Junction to ambient (DC) TO-92 150 Unit °C/W page 2/9 X006 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum average power dissipation versus average on-state current Figure 2. Average and DC on-state current versus lead temperature (TO-92) P(W) IT(AV) (A) 0.6 1.0 α = 180° TO-92 0.9 0.5 D.C. 0.8 0.7 0.4 0.6 α = 180° 0.5 0.3 0.4 0.2 0.3 360° 0.2 0.1 0.1 α IT(AV) (A) 0.0 0.1 0.2 Tl (°C) 0.0 0.0 0.3 0.4 0.5 0 0.6 25 50 75 100 125 Figure 3. Average and DC on-state current versus ambient Figure 4. Relative variation of thermal impedance junction temperature (epoxy printed circuit board FR4, copper to ambient versus pulse duration (PCB FR4, copper thickness = 35 µm, SCU = 0.5 cm2)(TO-92) thickness = 35 µm, SCU = 0.5 cm2)(TO-92) Zth(j-a) /Rth(j-a) IT(AV) (A) 1.0 1.00 TO-92 SCU = 0.5 cm2 TO-92 SCU = 0.5 cm2 0.9 D.C. 0.8 0.7 0.6 α = 180° 0.5 0.10 0.4 0.3 0.2 0.1 Tamb (°C) t p (s) 0.0 0 25 50 75 100 125 Figure 5. Relative variation of gate trigger, holding and latching current versus junction temperature (typical values) IGT,IH,IL [ Tj ] / IGT,IH,IL [T j =25°C] 0.01 1.E-03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 6. Relative variation of holding current versus gate-cathode resistance (typical values) 3.5 1.6 1.E-02 IH[R GK ] / IH[ RGK =1kΩ] 3.0 1.4 2.5 1.2 2.0 1.0 IH & IL 0.8 1.5 0.6 IGT 1.0 0.4 0.5 0.2 Tj (°C) 0.0 -40 -30 -20 -10 DS1704 - Rev 6 0 10 20 30 40 50 RGK (kΩ) 0.0 60 70 80 90 100 110 120 130 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 page 3/9 X006 Characteristics (curves) Figure 7. Relative variation of static dV/dt immunity versus gate-cathode resistance (typical values) Figure 8. Relative variation of static dV/dt immunity versus gate-cathode capacitance (typical values) dV/dt[R GK ] / dV/dt[ RGK =1kΩ] 100 100.0 dV/dt[C GK ] / dV/dt[R GK =1kΩ] VD = 0.67 x VDRM RGK = 1kΩ VD = 0.67 x VDRM 10.0 10 1.0 RGK (kΩ) CGK (nF) 0.1 1.0E-01 1.0E+00 1 1.0E+01 1 Figure 10. Non-repetitive surge peak on-state current for sinusoidal pulse (tp< 10 ms) Figure 9. Surge peak on-state current versus number of cycles 10 10 ITSM(A) ITSM(A) 1.E+02 Tj initial = 25 °C 9 8 ITSM tp = 10 ms 7 One cycle 1.E+01 Non repetitive Tj initial = 25 °C 6 5 4 Repetitive TC = 83 °C 1.E+00 3 2 1 t p (ms) Number of cycles 0 1 10 1.E-01 100 1000 0.01 0.10 1.00 10.00 Figure 11. On-state characteristics (maximum values) ITM(A) 10.00 Tj max.: Vt0 = 0.85 V Rd = 245 mΩ 1.00 Tj = 125 °C Tj = 25 °C 0.10 VTM(V) 0.01 0.0 DS1704 - Rev 6 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 page 4/9 X006 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-92 with straight leads (plastic) package information • • Lead free plating + halogen-free molding resin Epoxy meets UL94, V0 Figure 12. TO-92 with straight leads (plastic) package outline c A a B C b D F E Table 5. TO-92 with straight leads (plastic) package mechanical data Dimensions Inches(1) Millimeters Ref. Min. A Typ. Max. Min. 1.35 B Typ. 0.048 4.70 C Max. 0.190 2.54 0.100 D 4.40 0.172 E 12.70 0.554 F 3.70 0.152 a 0.50 0.022 b 1.27 c 0.050 0.48 0.019 1. Inches dimensions given for information DS1704 - Rev 6 page 5/9 X006 TO-92 with leads preform (plastic) package information 2.2 TO-92 with leads preform (plastic) package information • • Lead free plating + halogen-free molding resin Epoxy meets UL94, V0 Figure 13. TO-92 with leads preform (plastic) package outline Table 6. TO-92 with leads preform (plastic) package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. G 1.30 1.70 2.00 0.051 0.067 0.079 H 7.69 9.69 0.303 0.381 d 2.40 2.90 0.094 0.114 θ 30° 50° 30° 40° 40° 50° 1. Inches dimensions given for information DS1704 - Rev 6 page 6/9 X006 Ordering information 3 Ordering information Figure 14. Ordering information scheme X 006 02 M A 1AA2 Sensitive SCR series Current 006 = 0.8 A Sensitivity 02 = 200 µA Voltage M = 600 V Package A = TO-92 Packing mode 1AA2 = Bulk (TO-92 with straight leads) 2AL2 = Ammopack (TO-92 with leads preform) 5AL2 = Tape and reel (TO-92 with leads preform) Table 7. Ordering information Order code Marking X00602MA 1AA2 X00602MA 2AL2 X00602MA 5AL2 DS1704 - Rev 6 X0602 MA Package Weight Base qty. Delivery mode TO-92 straight leads 0.2 g 2500 Bulk 0.2 g 2000 Ammopack 0.2 g 2000 Tape and reel TO-92 leads preform page 7/9 X006 Revision history Table 8. Document revision history DS1704 - Rev 6 Date Revision Changes 26-May-2009 3 Last update. 03-May-2012 4 SOT-223 package added. 03-Sep-2021 5 Reformatted to current standards. Device X00605 removed. Updated dimensions in Table 5. 18-Jan-2022 6 Removed SOT-223 package information. Added Section 2.2 TO-92 with leads preform (plastic) package information. page 8/9 X006 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS1704 - Rev 6 page 9/9